Substrate holding device, exposure apparatus, and device manufacturing method

ABSTRACT

To provide a substrate holding apparatus which can prevent a liquid from entering into a rear surface side of a substrate. A substrate holding apparatus is provided with a base material, a first holding portion formed on the base material for holding the substrate, and a second holding portion formed on the base material for holding a plate member by surrounding the circumference of a processing substrate held by the first holding portion. The second holding portion holds the plate member so as to form a second space on the side of the rear surface of the plate member. On the rear surface of the plate member, an absorbing member is arranged for absorbing the liquid entered from a gap between the substrate held by the first holding portion and the plate member held by the second holding portion.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. Ser. No. 13/334,773, filedDec. 22, 2011, which is a divisional of U.S. Ser. No. 11/575,392, filedMar. 15, 2007, now U.S. Pat. No. 8,102,512, which is based on PCTApplication No. PCT/JP2005/017173 filed Sep. 16, 2005, and JapaneseApplication No. 2004-271634 filed on Sep. 17, 2004, the disclosures ofwhich are hereby incorporated herein by reference.

TECHNICAL FIELD

The present invention relates to a substrate holding device that holds asubstrate to be processed, an exposure apparatus that exposes asubstrate to be processed, and a device manufacturing method.

The present invention claims priority to Japanese Patent Application No.2004-271634, filed on Sep. 17, 2004, and its content is incorporatedherein by reference.

BACKGROUND ART

In the photolithography process, which is one of the processes formanufacturing micro-devices such as semiconductor devices or liquidcrystal display devices, an exposure apparatus that projection-exposes apattern formed on a mask onto a photosensitive substrate is used. Suchan exposure apparatus has a mask stage that supports a mask and asubstrate stage that supports a substrate and, while successively movingthe mask stage and the substrate stage, exposes the pattern of the maskonto the substrate via a projection optical system. In manufacturingmicro-devices, miniaturization of the pattern formed on a substrate isrequired in order to make such micro-devices high-density ones. Toaddress this requirement, it is desired that the exposure apparatus havea still higher resolution; as a means for realizing such a still higherresolution, such a liquid immersion exposure apparatus as disclosed inthe patent document 1, below, in which exposure processes are performedin a state that the space between a projection optical system and asubstrate is filled with a liquid having a higher refractive indexcompared with gases, has been devised.

Patent Document 1: PCT International Publication WO 99/49504. DISCLOSUREOF INVENTION Problems to be Solved by the Invention

By the way, in the case where, as shown in FIG. 19, a peripheral area(edge area) E of a substrate (substrate to be processed) P isliquid-immersion exposed, there arises the case where a portion ofliquid immersion region AR2′ covering projection area AR1′ of theprojection optical system is formed outside the substrate P. In such acase where the edge area E of the substrate P is exposed in a state thata portion of the liquid immersion region AR2′ is formed outside thesubstrate P, there arises a possibility that the liquid finds its wayover to the rear surface side of the substrate via, e.g., the gap(clearance) between the substrate and the substrate stage and penetratesinto the space between the substrate and the substrate stage (substrateholder). In that case, there arises a possibility that the substratestage cannot hold the substrate well. For example, since the liquidhaving penetrated into the space between the substrate and the substratestage acts as a foreign material, there arises a possibility thatdeterioration of the flatness of the supported substrate is induced.Further, with the liquid having penetrated evaporating, an adhesiontrace (hereinafter, referred to as water mark even when the liquid isnot water) may be formed. Since the water mark also acts as a foreignmaterial, there arises the possibility that deterioration of theflatness of the supported substrate is induced. Still further, there mayalso arises disadvantages, e.g., the disadvantage that the substratestage is thermally deformed by the evaporation heat generated when theliquid having penetrated into the space between the substrate and thesubstrate stage evaporates.

The purpose of some aspects of the invention is to provide a substrateholding device and an exposure apparatus that are capable of preventinga liquid from penetrating toward the rear surface side of a substrateand a device manufacturing method using such exposure apparatus.

Means for Solving the Problem

To resolve the above-described problems, the present invention adoptsthe following configurations that are illustrated in the embodiments andcorrespond to FIGS. 1-18. It is to be noted that the parenthesizedletter or numeral attached to each constituent element only exemplifiessuch element and does not limit its scope.

In accordance with a first aspect of the present invention, there isprovided a substrate holding device for holding a substrate to beprocessed which is to be exposed via a liquid, comprising: a basemember, a first holding portion that is formed on the base member andholds the substrate to be processed, and a second holding portion thatis formed on the base member and holds a plate member so as to surroundthe circumference of the substrate to be processed held by the firstholding portion, wherein the second holding portion holds the platemember so that a space is formed on the rear surface side of the platemember, and wherein on the rear surface of the plate member T isdisposed an absorbing member that absorbs a liquid having penetratedthrough a gap between the substrate to be processed held by the firstholding portion and the plate member held by the second holding portion.

In accordance with the first aspect of the present invention, since theliquid having penetrated through the gap between the substrate to beprocessed and the plate member is absorbed by the absorbing member, theliquid's penetration into the rear surface side space of the substrateto be processed can be prevented. Thus, the substrate holding device canhold well the substrate to be processed.

In accordance with a second aspect of the present invention, there isprovided a substrate holding device for holding a substrate to beprocessed which is to be exposed via a liquid, comprising: a basemember, a first holding portion that is formed on the base member andholds the substrate to be processed, and a second holding portion thatis formed on the base member and holds a plate member so as to surroundthe circumference of the substrate to be processed held by the firstholding portion, wherein on a side surface of the plate member whichside surface faces an object is provided a recovery port that recoversthe liquid.

In accordance with the second aspect of the present invention, since theliquid having penetrated through a gap between the object such as thesubstrate to be processed and the plate member is recovered via therecovery port provided on the side surface of the plate member, whichside surface faces the object, the liquid's penetration into the rearsurface side space of the object can be prevented. Thus, the substrateholding device can hold the object well.

In accordance with a third aspect of the present invention, there isprovided a substrate holding device for holding a substrate to beprocessed which is to be exposed via a liquid, comprising: a basemember, a first holding portion that is formed on the base member andholds the substrate to be processed, and a second holding portion thatis formed on the base member and holds a plate member so as to surroundthe circumference of the substrate to be processed held by the firstholding portion, wherein the first holding portion has a firstsupporting portion, having a protruding shape, that supports the rearsurface of the substrate to be processed and a first peripheral wallportion that is formed so as to face the rear surface of the substrateto be processed and surround the first supporting portion, and whereinan upper surface of the first peripheral wall portion which faces therear surface of the substrate to be processed is applied with a surfaceroughening treatment.

In accordance with the third aspect of the present invention, since thefirst peripheral wall's upper surface applied with the surfaceroughening treatment prevents the movement of the liquid, penetration ofthe liquid into the rear surface side space of the substrate to beprocessed via a space between the rear surface of the substrate to beprocessed and the first peripheral wall's upper surface can beprevented. Thus, the substrate holding device can hold well thesubstrate to be processed.

In accordance with a fourth aspect of the present invention, there isprovided a substrate holding device for holding a substrate to beprocessed which is to be exposed via a liquid, comprising: a basemember, a first holding portion that is formed on the base member andholds the substrate to be processed, and a second holding portion thatis formed on the base member and holds a plate member so as to surroundthe circumference of the substrate to be processed held by the firstholding portion, wherein the first holding portion has a firstsupporting portion, having a protruding shape, that supports the rearsurface of the substrate to be processed and a first peripheral wallportion that is formed so as to face the rear surface of the substrateto be processed and surround the first supporting portion, and whereinoutside the first peripheral wall portion is provided a liquid-repellentmember having a liquid-repellency relative to the liquid.

In accordance with the fourth aspect of the present invention, since theliquid having penetrated through a gap between the substrate to beprocessed and the plate member is repelled by the liquid-repellentmember provided outside the first peripheral wall portion, the liquid'spenetration into the rear surface side space of the substrate to beprocessed can be prevented. Thus, the substrate holding device can holdwell the substrate to be processed.

In accordance with a fifth aspect of the present invention, there isprovided a substrate holding device for holding a substrate to beprocessed which is to be exposed via a liquid, comprising: a basemember, a first holding portion that is formed on the base member andholds the substrate to be processed, and a second holding portion thatis formed on the base member and holds a plate member so as to surroundthe circumference of the substrate to be processed held by the firstholding portion, wherein the first holding portion has a firstsupporting portion, having a protruding shape, that supports the rearsurface of the substrate to be processed and a first peripheral wallportion that is formed so as to face the rear surface of the substrateto be processed and surround the first supporting portion, and whereinoutside the first peripheral wall portion is provided a porous memberthat retains the liquid having penetrated through a gap betweensubstrate to be processed held by the first holding portion and theplate member held by the second holding portion.

In accordance with the fifth aspect of the present invention, since theliquid having penetrated through the gap between the substrate to beprocessed and the plate member is absorbed by the porous member disposedoutside the first peripheral wall portion holding the substrate to beprocessed, the liquid's penetration into the rear surface side space ofthe substrate to be processed can be prevented. Thus, the substrateholding device can hold well the substrate to be processed.

In accordance with a sixth aspect of the present invention, there isprovided a substrate holding device for holding a substrate to beprocessed which is to be exposed via a liquid, comprising: a basemember, a first holding portion that is formed on the base member andholds the substrate to be processed, and a second holding portion thatis formed on the base member and holds a plate member so as to surroundthe circumference of the substrate to be processed held by the firstholding portion, wherein the first holding portion has a firstsupporting portion, having a protruding shape, that supports the rearsurface of the substrate to be processed and a first peripheral wallportion that is formed so as to face the rear surface of the substrateto be processed and surround the first supporting portion, and whereinat least a portion of the first peripheral wall portion is formed by aporous body.

In accordance with the sixth aspect of the present invention, since theliquid having penetrated through a gap between the substrate to beprocessed and the plate member is retained by the porous body forming aportion of the first peripheral wall portion, the liquid's penetrationinto the rear surface side space of the substrate to be processed can beprevented. Further, it may also be configured such that the liquidhaving penetrated is sucked and recovered via the porous body or suchthat by blowing out a gas via the porous body, the liquid is preventedfrom penetrating into the rear surface side space of the substrate to beprocessed. Thus, the substrate holding device can hold well thesubstrate to be processed.

In accordance with a seventh aspect of the present invention, there isprovided a substrate holding device for holding a substrate to beprocessed exposed via a liquid, comprising: a base member, a firstholding portion that is formed on the base member and holds thesubstrate to be processed, and a second holding portion that is formedon the base member and holds a plate member so as to surround thecircumference of the substrate to be processed held by the first holdingportion, wherein the first holding portion has a first supportingportion, having a protruding shape, that supports the rear surface ofthe substrate to be processed and a first peripheral wall portion thatis formed so as to face the rear surface of the substrate to beprocessed and surround the first supporting portion, and wherein a gassupply mechanism that blows out a gas from at least a portion of thefirst peripheral wall portion is provided.

In accordance with the seventh aspect of the present invention, with thegas supply mechanism blowing out a gas, it can be prevented that theliquid having penetrated through a gap between the substrate to beprocessed and the plate member penetrates into the rear surface sidespace of the substrate to be processed. Thus, the substrate holdingdevice can hold well the substrate to be processed.

In accordance with an eighth aspect of the present invention, there isprovided an exposure apparatus that is provided with a substrate holdingdevice of any of the above-described aspects and exposes, via a liquid,a substrate to be processed held by the substrate holding device.

In accordance with the eighth aspect of the present invention, thesubstrate to be processed can be exposed with high accuracy in a statethat the substrate to be processed is held well by the substrate holdingdevice.

In accordance with a ninth aspect of the present invention, there isprovided a device manufacturing method that uses an exposure apparatusof the above-described aspect.

In accordance with the ninth aspect of the present invention, with asubstrate to be processed being exposed with high accuracy, a devicehaving a desired performance can be provided.

Effects of the Invention

In accordance with the present invention, a substrate to be processedcan be exposed well in a state that penetration of a liquid into therear surface side space of the substrate is prevented.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram showing an exposure apparatus of a firstembodiment of the present invention.

FIG. 2 is a sectional side view showing a substrate holder.

FIG. 3 is a plan view showing a substrate holder.

FIG. 4 is a plan view of a substrate stage.

FIG. 5 is an enlarged sectional view of a main portion of a substrateholder of a first embodiment.

FIG. 6 is an enlarged sectional view of a main portion of a substrateholder of a second embodiment.

FIG. 7 is a drawing showing a modification example of the secondembodiment.

FIG. 8 is an enlarged sectional view of a main portion of a substrateholder of a third embodiment.

FIG. 9 is a drawing showing a modification example of the thirdembodiment.

FIG. 10 is an enlarged sectional view of a main portion of a substrateholder of a fourth embodiment.

FIG. 11 is an enlarged sectional view of a main portion of a substrateholder of a fifth embodiment.

FIG. 12 is an enlarged sectional view of a main portion of a substrateholder of a sixth embodiment.

FIG. 13 is an enlarged sectional view of a main portion of a substrateholder of a seventh embodiment.

FIG. 14 is an enlarged sectional view of a main portion of a substrateholder of an eighth embodiment.

FIG. 15 is an enlarged sectional view of a main portion of a substrateholder of a ninth embodiment.

FIG. 16 is an enlarged sectional view of a main portion of a substrateholder of a tenth embodiment.

FIG. 17 is an enlarged sectional view of a main portion of a substrateholder of an eleventh embodiment.

FIG. 18 is a flowchart showing an example of a semiconductor-devicemanufacturing process.

FIG. 19 is a schematic for explaining problems of prior art.

BEST MODE FOR CARRYING OUT THE INVENTION

In the following, an exposure apparatus embodiment of the presentinvention will be described referring to the drawings, but the presentinvention is not limited to the embodiment.

Here, in the following description, an XYZ orthogonal coordinate systemwill be set, and the description will be made referring to the XYZorthogonal coordinate system. And, it is assumed that the direction thatcoincides with optical axis AX of projection optical system PL (verticaldirection) is referred to as the Z-axis direction, that a predetermineddirection in a plane perpendicular to the Z-axis direction is referredto as the X-axis direction, the direction perpendicular to the Z-axisdirection and the X-axis direction is referred to as the Y-axisdirection, and that the rotation (inclination) direction around theX-axis, the rotation (inclination) direction around the Y-axis, and therotation (inclination) direction around the Z-axis are respectivelyreferred to as the θX-direction, the θY-direction, and the θZ-direction.

FIG. 1 is a schematic diagram showing a first exposure apparatusembodiment relating to the present invention. In FIG. 1, exposureapparatus EX is provided with mask stage MST that is movable whilesupporting mask M, with substrate stage PST that has substrate holder(substrate holding device) PH which holds substrate P and that can movesubstrate P held by substrate holder PH, with illumination opticalsystem IL that illuminates mask M supported by mask stage MST withexposure light EL, with projection optical system PL that projects apattern image of mask M illuminated with exposure light EL ontosubstrate P supported by substrate stage PST, and with controller CONTthat controls the overall operation of exposure apparatus EX. It shouldbe noted that a “substrate” referred to herein is a substrate to beprocessed to which various kinds of processes, including an exposureprocess, are applied and comprehends a semiconductor wafer over whichphotoresist, a photosensitive material, is applied. Further, a “mask”comprehends a reticle on which a device pattern to bereduction-projected onto the substrate is formed.

Exposure apparatus EX of this embodiment is a liquid immersion exposureapparatus to which a liquid immersion method is applied, with theexposure wavelength being shortened in effect, to improve the resolutionand, at the same time, to widen the depth of focus and is provided withliquid immersion mechanism 1 for forming, between projection opticalsystem PL and substrate P, liquid immersion region AR2 of liquid LQ.Liquid immersion mechanism 1 is provided with liquid supply mechanism 10that supplies liquid LQ onto substrate P and with liquid recoverymechanism 20 that recovers liquid LQ on substrate P. Further, in thevicinity of the end portion of projection optical system PL disposednozzle member 70 which constitutes a portion of liquid immersionmechanism 1. Nozzle member 70 is a ring-shaped member that is disposedso as to surround optical element 2 located at the end portion ofprojection optical system PL on the image plane side and is providedwith supply port 12 for supplying liquid LQ onto substrate P and withrecovery port 22 for recovering liquid LQ. Further, in this embodiment,purified water or pure water is used as liquid LQ.

Exposure apparatus EX, at least while transferring the pattern image ofmask M onto substrate P, locally forms liquid immersion area AR2 on atleast a portion of substrate P so as to include projection area AR1 ofprojection optical system PL. Liquid immersion region AR2 is larger thanprojection area AR1 and is smaller than substrate P with liquid LQhaving been supplied from liquid supply mechanism 10. More specifically,exposure apparatus EX, by filling with liquid LQ the space betweenoptical element 2 located at the end portion of the projection opticalsystem PL on the image plane side and the surface (exposure surface) ofsubstrate P and by projecting, via this liquid LQ between projectionoptical system PL and substrate P, the pattern image of mask M ontosubstrate P held by substrate holder PH, exposes substrate P.

Illumination optical system IL is for illuminating mask M supported bymask stage MST with exposure light EL and is provided with an exposurelight source that emits exposure light EL, an optical integrator thatuniforms the illuminance of exposure light EL emitted from the exposurelight source, a condenser lens that condenses exposure light EL from theoptical integrator, a relay lens system, a field stop that sets anillumination area formed by exposure light EL on mask M, etc. Aspecified illumination area on mask M is illuminated, by illuminationoptical system IL, with exposure light EL having a uniform illuminancedistribution. As exposure light EL emitted from illumination opticalsystem IL, for example, a bright line (g-line, h-line, i-line) emittedfrom a mercury lamp, a deep ultraviolet light (DUV light) such as a KrFexcimer laser light (wavelength of 248 nm), or a vacuum ultravioletlight (VUV light) such as an ArF excimer laser light (wavelength of 193nm) or an F₂ excimer laser light (wavelength of 157 nm) may be used. Inthe embodiment, an ArF excimer laser light is used. As described above,liquid LQ in the embodiment is purified water and can transmit exposurelight EL even when it is an ArF excimer laser light. Further, purifiedwater can transmit a bright line in the ultraviolet region (g-line,h-line, or i-line) and a deep ultraviolet light (DUV light) such as aKrF excimer laser light (wavelength of 248 nm).

Mask stage MST is, while holding mask M, movable and fixes mask M bymeans of, e.g., vacuum suction (or electrostatic suction). Mask stageMST is two-dimensionally movable in a plane perpendicular to opticalaxis AX, i.e., in the XY-plane, and is finely rotatable in theθZ-direction. On mask stage MST is set moving mirror 91 for laserinterferometer 92, and the two-dimensional (XY-direction) position andthe rotation angle in the θZ-direction (including the rotation angles inthe θX- and θY-directions in some cases) of mask M on mask stage MST aremeasured by laser interferometer 92 in real time. By driving mask stagedriver MSTD that includes a linear motor etc. based on the measurementresults from laser interferometer 92, controller CONT controls theposition of mask M supported by mask stage MST.

Projection optical system PL is for projecting the pattern of mask Monto substrate P at a predetermined projection magnification of β.Projection optical system PL is constituted by a plurality of opticalelements including optical element 2 disposed at the end portion on theside of substrate P, and these optical elements are supported by lensbarrel PK. In the embodiment, projection optical system PL is areduction system of which projection magnification β is, e.g., ¼, ⅕, or⅛. It should be noted that projection optical system PL may also beeither a unit magnification system or a magnifying system. In addition,liquid LQ of liquid immersion region AR2 comes into contact with opticalelement 2, which is located at the end portion of projection opticalsystem PL.

Substrate stage PST is provided with substrate holder PH that sucks andholds substrate P and with plate member T held by substrate holder PH.Substrate stage PST, on base BP, is two-dimensionally movable in theXY-plane and is finely rotatable in the θZ-direction. Further, substratestage PST is also movable in the Z-axis-direction, in the θX-direction,and in the θY-direction. In other words, substrate P held by substrateholder PH is movable in the Z-axis-direction, in the θX- andθY-directions (inclination directions), in the two-dimensional direction(XY-direction), and in the θZ-direction. On the side face of substratestage PST is provided moving mirror 93 for laser interferometer 94, andthe two-dimensional position and the rotation angle in the OZ-directionof substrate holder PH (substrate stage PST) are measured by laserinterferometer 94 in real time. Further, although not shown, exposureapparatus EX is provided with such a focus-leveling detection system asdisclosed in, e.g., Japanese Unexamined Patent Application, PublicationNo. H08-37149 that detects the position information of the surface ofsubstrate P held by substrate holder PH of substrate stage PST. Thefocus-leveling detection system detects the position information in theZ-axis-direction of the surface of substrate P and the inclinationinformation in the θX- and θY-directions of substrate P. By driving, viasubstrate stage driver PSTD, substrate stage PST based upon measurementresults from laser interferometer 94 and detection results from thefocus-leveling detection system, controller CONT controls the positionin the Z-axis-direction (focus position), the position in theinclination directions, the position in the XY-direction, and theposition in the θZ-direction of substrate P held by substrate holder PH.Note that the movement mechanism of substrate stage PST is disclosed in,e.g., Japanese Unexamined Patent Application, Publication No. H09-5463and Japanese Unexamined Patent Application, Publication No. S59-101835.

Liquid supply mechanism 10 is for supplying liquid LQ to the image planeside space of projection optical system PL and is provided with liquidsupply portion 11 capable of delivering liquid LQ and with supply pipe13 of which one end portion is connected to liquid supply portion 11.The other end portion of supply pipe 13 is connected to nozzle member70. Liquid supply portion 11 is provided with a tank that stores liquidLQ, a pressurizing pump, a filter unit that removes foreign particlesand air bubbles included in liquid LQ, etc.

Liquid recovery mechanism 20 is for recovering liquid LQ existing on theimage plane side of projection optical system PL and is provided withliquid recovery portion 21 capable of recovering liquid LQ and withrecovery pipe 23 of which one end is connected to liquid recoveryportion 21. The other end of recovery pipe 23 is connected to nozzlemember 70. Liquid recovery portion 21 is provided with a vacuum system(suction device), e.g., a vacuum pump, a gas-liquid separator thatseparates the recovered liquid LQ from gas, a tank that stores therecovered liquid LQ, etc. It should be noted that as the vacuum system,a vacuum system of a factory in which exposure apparatus EX is installedmay be used, without exposure apparatus EX being provided with a vacuumsystem.

Nozzle member 70 is a ring-shaped member that is provided so as tosurround, above substrate P (substrate stage PST), the side face ofoptical element 2. Between nozzle member 70 and optical element 2 isprovided a clearance, and nozzle member 70 is supported by a certainsupporting mechanism so as to be vibrationally isolated from opticalelement 2. In nozzle member 70's undersurface 70A that faces substrate Pis provided with supply port 12 that supplies liquid LQ onto substrateP. Further, inside nozzle member 70 is formed a supply flow path throughwhich liquid LQ to be supplied onto substrate P flows. One end portionof the supply flow path of nozzle member 70 is connected to the otherend portion of supply pipe 13, and the other end portion of the supplyflow path is connected to supply port 12.

Further, in undersurface 70A of nozzle member 70 is provided withrecovery port 22 that recovers liquid LQ on substrate P. In theembodiment, recovery port 22 is provided, in undersurface 70A of nozzlemember 70, in a ring-shaped manner so as to surround optical element 2(projection area AR1) of projection optical system PL and supply port12. Further, inside nozzle member 70 is formed a recovery flow paththrough which liquid LQ having been recovered via recovery port 22flows. One end portion of the recovery flow path of nozzle member 70 isconnected to the other end portion of recovery pipe 23, and the otherend portion of the recovery flow path is connected to recovery port 22.

The operation of liquid supply portion 11 is controlled by controllerCONT. When supplying liquid LQ onto substrate P, controller CONTdelivers liquid LQ from liquid supply portion 11 and supplies liquid LQof a predetermined per-unit-time amount onto substrate P from supplyports 12 provided above substrate P via supply pipe 13 and the supplyflow path formed inside nozzle member 70. Further, the operation ofliquid recovery portion 21 is also controlled by controller CONT.Controller CONT can control the per-unit-time liquid recovery amount byliquid recovery portion 21. Liquid LQ that has been recovered fromsubstrate P via recovery port 22 provided above substrate P is recoveredby and into liquid recovery portion 21 via the recovery flow path formedinside nozzle member 70 and recovery pipe 23.

Next, referring to FIGS. 2-4, substrate stage PST (substrate holder PH)will be described. FIG. 2 is a sectional side view of substrate P andsubstrate holder PH having sucked and held plate member T, describedlater; FIG. 3 is a plan view of substrate holder PH viewed from above;FIG. 4 is a plan view of substrate stage PST viewed from above.

In FIG. 2, substrate holder PH is provided with base member PHB, withfirst holding portion PH1 that is formed on base member PHB andsuck-and-holds substrate P, and with second holding portion PH2 that isformed on base member PHB and suck-and-holds plate member T so as tosurround substrate P suck-and-held by first holding portion PH1. Platemember T is a member different from base member PHB and is provideddetachably (exchangeably) relative to base member PHB of substrateholder PH. Further, as shown in FIG. 4, plate member T is anapproximately ring-shaped member, and in the center portion thereof isformed an approximately circular hole portion TH in which substrate Pcan be placed. Plate member T held by second holding portion PH2 isplaced so as to surround the circumference of substrate P held by firstholding portion PH1. The outline of plate member T is formed berectangular as viewed from above so as to follow the shape of basemember PHB. In the embodiment, the state in which plate member T issuck-and-held by base member PHB is referred to as substrate stage PST.

In FIG. 2, each of upper side surface Ta and rear surface Tb of platemember T is formed to be a flat surface (flat portion). Further, thethickness of plate member T is substantially the same as that ofsubstrate P. And, surface (flat surface) Ta of plate member T held bysecond holding portion PH2 and upper side surface Pa of substrate P heldby first holding portion PH1 are substantially co-planer with eachother. In other words, plate member T held by second holding portion PH2forms, around substrate P held by first holding portion PH1, surface Tathat constitutes substantially the same plane as surface Pa of substrateP. In the embodiment, when substrate P is held by substrate stage PST,the upper surface of substrate stage PST, including surface Pa ofsubstrate P held, is formed so that it forms a flat surface oversubstantially the whole area.

As shown in FIGS. 2 and 3, first holding portion PH1 of substrate holderPH is provided with protruding first supporting portions 46 formed onbase member PHB and with a ring-shaped first peripheral wall portion 42formed on base member PHB so as to surround the circumference of firstsupporting portions 46. First supporting portions 46 are for supportingrear surface Pb of substrate P and are formed plurally and uniformlyinside first peripheral wall portion 42. In the embodiment, firstsupporting portions 46 include a plurality of supporting pins. Firstperipheral wall portion 42 is formed to be approximately ring-shaped inaccordance with the shape of substrate P. Upper surface 42A of firstperipheral wall portion 42 is formed so as to face the peripheral region(edge region) of rear surface Pb of substrate P. On the side of rearsurface Pb of substrate P held by first holding portion PH1 is formedfirst space 31 surrounded by base member PHB, first peripheral wallportion 42, and rear surface Pb of substrate P.

Inside portion of first peripheral wall portion 42 on base member PHBare formed first suction ports 41. First suction ports 41 are forsuck-and-holding substrate P, and each of them is provided, inside firstperipheral wall portion 42, at each of predetermined positions on theupper surface of base member PHB, the predetermined positions beingother than the positions where first supporting portions 46 are located.In the embodiment, first suction ports 41 are provided plurally anduniformly inside first peripheral wall portion 42. Each of first suctionports 41 is connected to first vacuum system 40 via flow path 45. Firstvacuum system 40 includes a vacuum pump and is for making first space 31surrounded by base member PHB, first peripheral wall portion 42, andrear surface Pb of substrate P have a negative pressure. As describedabove, first supporting portions 46 include the supporting pins, andfirst holding portion PH1 of the embodiment constitutes at least aportion of a so-called pin chuck mechanism. First peripheral wallportion 42 functions as an outer wall surrounding the outside of firstspace 31 including first supporting portions 46. Controller CONT drivesfirst vacuum system 40 to suck out the gas (air) inside first space 31surrounded by base member PHB, first peripheral wall portion 42, andsubstrate P and thus to make first space 31 have a negative pressure,thereby substrate P is suck-and-held by first supporting portions 46.

Second holding portion PH2 of substrate holder PH is provided with anapproximately ring-shaped second peripheral wall portion 62 formed onbase member PHB so as to surround first peripheral wall portion 42 offirst holding portion PH1, with a ring-shaped third peripheral wallportion 63 that is provided outside second peripheral wall portion 62and is formed on base member PHB so as to surround second peripheralwall portion 62, and with protruding second supporting portions 66formed on base member PHB, the portion being located between secondperipheral wall portion 62 and third peripheral wall portion 63. Secondsupporting portions 66 are for supporting rear surface Pb of substrate Pand are formed plurally and uniformly between second peripheral wallportion 62 and third peripheral wall portion 63. In the embodiment, aswith first supporting portions 46, second supporting portions 66 arealso constituted by including a plurality of pins. Second peripheralwall portion 62 is provided outside first peripheral wall portion 42relative to first space 31, and third peripheral wall portion 63 isprovided further outside second peripheral wall portion 62. Further,second peripheral wall portion 62 is formed to be approximatelyring-shaped to correspond to the shape of hole portion TH of platemember T, third peripheral wall portion 63 is formed to be approximatelyrectangle-shaped to correspond to the outline of plate member T. Uppersurface 62A of second peripheral wall portion 62 is formed so as to facethe inner, peripheral region (edge region on the inner side), located inthe vicinity of hole portion TH, of rear surface Tb of plate member T.Upper surface 63A of third peripheral wall portion 63 is formed so as toface the outer, peripheral region (edge region on the outer side) ofrear surface Tb of plate member T. On the side of rear surface Tb ofplate member T held by second holding portion PH2 is formed second space32 surrounded by base member PHB, second peripheral wall portion 62,third peripheral wall portion 63, and rear surface Tb of plate member T.

Second suction ports 61 are formed between second peripheral wallportion 62 and third peripheral wall portion 63 on base member PHB.Second suction ports 61 are for suck-and-holding plate member T, andeach of them is provided, between second peripheral wall portion 62 andthird peripheral wall portion 63, at each of predetermined positions onthe upper surface of base member PHB, the predetermined positions beingother than the positions where second supporting portions 66 arelocated. In the embodiment, second suction ports 61 are providedplurally and uniformly between second peripheral wall portion 62 andthird peripheral wall portion 63.

Each of second suction ports 61 is connected to second vacuum system 60via flow path 65. Second vacuum system 60 includes a vacuum pump and isfor making second space 32 surrounded by base member PHB, secondperipheral wall portion 62, third peripheral wall portion 63, and rearsurface Tb of plate member T have a negative pressure. As describedabove, second supporting portions 66 include the supporting pins, and,as with first holding portion PH1, second holding portion PH2 of theembodiment also constitutes at least a portion of a so-called pin chuckmechanism. Second peripheral wall portion 62 and third peripheral wallportion 63 function as an outer wall surrounding the outside of secondspace 32 including second supporting portions 66. Controller CONT drivessecond vacuum system 60 to suck out the gas (air) inside second space 32surrounded by base member PHB, second peripheral wall portion 62, thirdperipheral wall portion 63, and plate member T and thus to make secondspace 32 have a negative pressure, plate member T is suck-and held bysecond supporting portions 66.

It is to be noted that while, in the embodiment, the pin chuck mechanismis used for suck-and-holding substrate P, another type of chuckmechanism may be adopted. Similarly, while the pin chuck mechanism isused for suck-and-holding plate member T, another type of chuckmechanism may be adopted. Further, while, in the embodiment, the vacuumsuction mechanisms are adopted for suck-and-holding substrate P andplate member T, it may also be configured such that at least one ofsubstrate P and plate member T is held by using another type ofmechanism, e.g., an electrostatic suction mechanism.

First vacuum system 40 for making first space 31 have a negativepressure and second vacuum system 60 for making second space 32 have anegative pressure are independent of each other. Controller CONT cancontrol separately the operation of first vacuum system 40 and theoperation of second vacuum system 60, and the suction operation by firstvacuum system 40 for first space 31 and the suction operation by secondvacuum system 60 for second space 32 can be performed independently ofeach other. Further, by controlling each of first vacuum system 40 andsecond vacuum system 60, controller CONT can also make the pressure offirst space 31 and the pressure of second space 32 different from eachother.

As shown in FIGS. 2 and 4, between the outer edge portion of substrate Pheld by first holding portion PH1 and the inner side (hole portion THside) edge portion of plate member T provided around substrate P isformed gap (clearance) A of about 0.1 to 1.0 mm. In the embodiment, gapA is of about 0.3 mm.

Further, as shown in FIG. 4, substrate P of the embodiment has notchportion NT, which is a cut portion for alignment. The shape of platemember T is determined in accordance with the outline of substrate P(the shape of notch portion NT) so that the gap between substrate P andplate member T at the position of notch portion NT is also set to be ofabout 0.1 to 1.0 mm. Specifically, plate member T has protrusion portion150 protruding toward the inner side of hole portion TH so as tocorrespond to the shape of notch portion NT. With this configuration,gap A of about 0.1 to 1.0 mm is secured between the entire region of theedge portion of substrate P, including notch portion NT, and platemember T. Further, second peripheral wall portion 62 and its uppersurface 62A of second holding portion PH2 has protruding or convexportion 62N that corresponds to the shape of protrusion portion 150 ofplate member T.

Further, first peripheral wall portion 42 and its upper surface 42A offirst holding portion PH1 has depression or recess portion 42N thatcorresponds to the shape of protruding portion 62N of second peripheralwall portion 62 and the shape of notch portion NT of substrate P.Depression portion 42N of first peripheral wall portion 42 is providedin the position facing protruding portion 62N of second peripheral wallportion 62, and between depression portion 42N and protruding portion62N is formed a predetermined gap.

It should be noted that the above description has been made by assuming,by way of example, notch portion NT as a cut portion of substrate P, butwhen there is no cut portion or when substrate P has an orientation flatportion (“orifla” portion) as a cut portion, it may be configured suchthat each of the shapes of plate member T, first peripheral wall portion42, and second peripheral wall portion 62 is made to have a shapecorresponding to the outline of substrate P to secure the predeterminedgap A between substrate P and plate member T therearound.

FIG. 5 is an enlarged sectional view of substrate P and the main portionof substrate holder PH on which plate member T is held.

In FIG. 5, between side surface Pc of substrate P and plate member T'sside surface Tc facing side surface Pc is secured gap A of about 0.1 to1.0 mm, as described above. Further, each of upper surface 42A of firstperipheral wall portion 42 and upper surface 62A of second peripheralwall portion 62 is a flat surface. Note that, although not shown in FIG.5, upper surface 63A of third peripheral wall portion 63 is also a flatsurface. Further, in the embodiment, first supporting portions 46 offirst holding portion PH1 are formed to have the same or slightly higherheight compared with first peripheral wall portion 42. And, rear surfacePb of substrate P is supported by upper surfaces 46A of first supportingportions 46.

On rear surface Tb of plate member T is disposed absorbing member 100that is capable of absorbing liquid LQ. Absorbing member 100 is forabsorbing liquid LQ having penetrated through gap A and is formed by aporous member, including a sponge member. Absorbing member 100 mayprovided on approximately the entire region of rear surface Tb of platemember T or may be provided on only the inner, peripheral region,located near hole portion TH, of rear surface Tb of plate member T.

Second supporting portions 66 of second holding portion PH2 is formed tohave a height slightly larger than that of second peripheral wallportion 62. Even in the state in which with second space 32 being madeto have a negative pressure, plate member T is suck-and-held on secondsupporting portions 66, gap B is formed between rear surface Tb of platemember T (including the rear surface of absorbing member 100) and uppersurface 62A of second peripheral wall portion 62. Gap B is smaller thangap A and is of about a few μm (e.g., 3 μm). Since gap B is very small,the negative pressure of second space 32 maintained.

Further, second holding portion PH2 is provided with recovery mechanism101 that suck-and-recovers liquid LQ having been absorbed and held byabsorbing member 100. Recovery mechanism 101 is provided with protrudingportion 102 that is formed in predetermined position on base member PHB,the predetermined position being located between second peripheral wallportion 62 and third peripheral wall portion 63, with recovery ports 103formed on upper surface 102A of protruding portion 102, and with vacuumsystem 105 that is connected to recovery ports 103 via flow path 104.Each of recovery ports 103 is formed at each of predetermined positionson upper surface 102A of protruding portion 102. Protruding portion 102is provided so that upper surface 102A of protruding portion 102 comesinto contact with absorbing member 100 on rear surface Tb of platemember T held by second supporting portions 66. When vacuum system 105is activated, liquid LQ held by absorbing member 100, which is a porousmember, is suck-and-recovered by and into vacuum system 105 via recoveryports 103, which are in contact with absorbing member 100, and is thenstored into a predetermined tank. Since recovery ports 103 are formed onupper surface 102A, which is in contact with absorbing member 100,liquid LQ held by absorbing member 100 can be smoothly recovered. It isto be noted that although not shown, midway along flow path 104 betweenrecovery ports 103 and vacuum system 105 is provided a gas-liquidseparator that separates liquid LQ recovered through recovery ports 103from gas, and thus liquid LQ is prevented from flowing into vacuumsystem 105.

It should be noted that protruding portion 102 is only required to beprovided in such a manner that upper surface 102A and absorbing member100 on rear surface Tb of plate member T come into contact with eachother and may be, for example, formed to be ring-shaped as viewed fromabove or may be formed such that supporting frame 120 is divided intomultiple, smaller portions, and each of the smaller portions is formedin each of multiple, predetermined positions on base member PHB.Further, upper surface 102A is not necessarily be required to be incontact with absorbing member 100 and, in short, is only required to becapable of recovering, via recovery ports 103, liquid LQ held byabsorbing member 100.

Further, between first peripheral wall portion 42 and second peripheralwall portion 62 is formed gap C. Gap C is larger than gap A and is,e.g., of about 2.5 mm. Further, the outside diameter of the ring-shapedfirst peripheral wall portion 42 of first holding portion PH1 is formedto be smaller than the diameter of substrate P, and thus the peripheralregion of substrate P overhangs outside first peripheral wall portion 42by a predetermined amount. Further, the inside diameter of thering-shaped second peripheral wall portion 62 is formed to be largerthan the inside diameter of hole portion TH of plate member T, and thusthe inner, peripheral region located near hole portion TH of platemember T overhangs inside second peripheral wall portion 62 by apredetermined amount.

Further, between rear surface Pb of substrate P and upper surface 42A offirst peripheral wall portion 42 is formed a predetermined gap D. In theembodiment, gap B, gap D, the negative pressure of first space 31, andthe negative pressure of second space 32 are set so that the suctionforce exerted on liquid LQ toward gap B becomes larger than the suctionforce exerted on liquid LQ toward gap D.

Further, second suction ports 61 formed on base member PHB have afunction of liquid recovery ports for recovering liquid LQ havingpenetrated through gap A between substrate P held by first holdingportion PH1 and plate member T held by second holding portion PH2. Inother words, it is configured such that even when liquid LQ that hadpenetrated through gap A has penetrated into second space 32 via gap B,liquid LQ is suck-and-recovered through second suction ports 61. Here,also midway along flow path 65, which connects second suction ports 61and second vacuum system 60, is provided a gas-liquid separator, andthus liquid LQ having recovered through second suction ports 61 isprevented from flowing into second vacuum system 60.

Returning to FIG. 2, upper surface 63A of third peripheral wall portion63 is a flat surface, and third peripheral wall portion 63 is formed tohave a slightly lower height compared with second supporting portions66. And, between upper surface 63A of third peripheral wall portionthird peripheral wall portion 63 and rear surface Tb of plate member Tis formed a predetermined gap K. Further, plate member T is formed to belarger than the outline of third peripheral wall portion 63, and thusthe outer, peripheral region of plate member T overhangs outside thirdperipheral wall portion 63 by a predetermined amount. There is apossibility that when liquid LQ on plate member T flows out to theoutside of plate member T, liquid LQ having flowed out adheres to movingmirror 93 provided on the side face of substrate holder PH. However,since plate member T overhangs outside third peripheral wall portion 63and, thus, outside moving mirror 93, liquid LQ having flowed out to theoutside of plate member T is prevented from adhering to moving mirror93. Further, since gap K is formed between plate member T and uppersurface 63A of third peripheral wall portion 63, there is generated agas flow proceeding from the outside of second space 32 to the insidethereof via gap K, with second space 32 being made to have a negativepressure by second vacuum system 60. Thus, since liquid LQ having flowedout to the outside of plate member T is drawn into second space 32 viagap K before liquid LQ flows to the side face of substrate holder PH,including moving mirror 93, the disadvantage that liquid LQ would adhereto moving mirror 93 can be more reliably prevented.

Each of surface Ta, rear surface Tb, and side surface Tc of plate memberT is coated with a liquid-repellent material having a liquid-repellencyrelative to liquid LQ. As the liquid-repellent material, there can belisted, e.g., a fluoroplastic material, e.g., polytetrafluoroethyleneand an acrylic plastic material. In the embodiment, plate member T madeof silica glass is coated with “CYTOP”, manufactured by Asahi Glass Co.,Ltd. It is to be noted that as the liquid-repellent material with whichplate member T is to be coated, HMDS (hexamethyl-disilazane) may also beused. Alternatively, in order to make plate member T liquid-repellent,plate member T itself may be formed by a liquid-repellent material suchas a fluoro-material.

Surface Pa, which is the exposure surface of substrate P, is coated withphotoresist (a photosensitive material). In the embodiment, thephotosensitive material is a photosensitive material for ArF excimerlaser and has a liquid-repellency relative to liquid LQ. Further, in theembodiment, rear surface Pb and side surface Pc of substrate P are alsocoated with a liquid-repellent material having a liquid-repellencyrelative to liquid LQ. As the liquid-repellent material with which rearsurface Pb and side surface Pc of substrate P are to be coated, theabove-mentioned photosensitive material can be listed. Further, there isa case where a protective layer (film for protecting the photosensitivematerial from the liquid), called top coat layer, is applied on thephotosensitive material applied on surface Pa, which is the exposuresurface of substrate P; in this connection, when the material forforming the top coat layer is a liquid-repellent material, e.g., afluoroplastic material, the material for forming the top coat layer maybe used as the liquid-repellent material with which rear surface Pb andside surface Pc of substrate P are to be coated. Further, as theliquid-repellent material with which rear surface Pb and side surface Pcof substrate P are to be coated, HMDS (hexamethyl-disilazane) may alsobe used. Further, it may also be configured such that surface Pa ofsubstrate P is coated with HMDS as the top coat layer.

Further, it may also be configured such that by applying aliquid-repellency treatment to at least a portion of the surface of basemember PHB of substrate holder PH, a liquid-repellency relative toliquid LQ is given thereto. In the embodiment, of base member PHB ofsubstrate holder PH, upper surface 42A and outside surface 42C (the facefacing second peripheral wall portion 62) of first peripheral wallportion 42 of first holding portion PH1 and upper surfaces 46A of firstsupporting portions 46 have a liquid-repellency. Further, upper surface62A and inside surface 62B (the surface facing first peripheral wallportion 42) of second peripheral wall portion 62 of second holdingportion PH2 and upper surfaces 66A of second supporting portions 66 havea liquid-repellency. As the liquid-repellency treatment for substrateholder PH, there can be a treatment in which such a fluoroplasticmaterial, an acrylic plastic material, a photosensitive material, amaterial for forming a top coat layer, HMDS, or the like as describedabove is used for coating.

Next, there will be described an example of the operation of exposureapparatus EX having the above-described configuration and the working ofsubstrate holder PH.

Exposure apparatus main body EX of the embodiment is a scan typeexposure apparatus (the so-called scanning stepper) in which whilemoving mask M and substrate P in the X-direction (scanning direction),the pattern image of mask M is projected onto substrate P; and, duringscanning exposure, a pattern image of a part of mask M is projected ontoprojection area AR1 via liquid LQ of liquid immersion region AR2 andprojection optical system PL, and in synchronization with the movementof mask M in the −X direction (or in the +X direction) at speed V,substrate P moves, relative to projection area AR1, in the +X direction(or in the −X direction) at speed β·V (β is the projectionmagnification). On substrate P are set a plurality of shot areas. Aftercompletion of exposure of one shot area, a next shot area moves to thescan starting position through the stepping movement of substrate P. Inthis way, the scanning exposure process of each shot area issuccessively performed, with substrate P being moved in accordance withthe step-and-scan method.

When exposing peripheral area (edge area) E of surface Pa of substrateP, there arises, as shown in FIG. 5, a state in which a portion ofliquid immersion region AR2 formed on the image plane side of projectionoptical system PL is formed outside substrate P, and in this state,liquid immersion region AR2 of liquid LQ is formed on gap A. In thiscase, there is a possibility that liquid LQ of liquid immersion regionAR2 penetrates through gap A and finds its way over to the side of rearsurface Pb of substrate P. However, since gap A between substrate P heldby first holding portion PH1 and plate member T held by second holdingportion PH2 is set to be of about 0.1 to 1.0 mm, penetration of liquidLQ into gap A is prevented through the surface tension of liquid LQ.Further, since, in the embodiment, surface Ta and side surface Tc ofplate member T are liquid-repellent, and, at the same time, side surfacePc of substrate P is also liquid-repellent, penetration of liquid LQfrom gap A is more reliably prevented. Thus, even when exposing edgearea E of substrate P, liquid LQ can be held beneath projection opticalsystem PL by plate member T.

Further, even if liquid LQ has penetrated from gap A, since on rearsurface Tb of plate member T is provided absorbing member 100, whichabsorbs liquid LQ, liquid LQ having penetrated from gap A is, withoutgetting into the side of rear surface Pb of substrate P, drawn to theside of rear surface Tb of plate member T and is absorbed by absorbingmember 100. Thus, the disadvantage that liquid LQ having penetrated fromgap A would find its way over to the side of rear surface Pb ofsubstrate P can be prevented.

Further, since liquid LQ absorbed (held) by absorbing member 100 isrecovered by recovery mechanism 101, such a disadvantage that liquid LQwould drop from absorbing member 100 onto, e.g., base member PHB insidesecond space 32 is prevented. It should be noted that even if liquid LQhas dropped from absorbing member 100, since, as described above, secondsuction ports 61 formed on base member PHB have a function of liquidrecovery ports for recovering liquid LQ, the dropped liquid LQ can berecovered via second suction ports 61.

Further, since, in the embodiment, gap B, gap D, the negative pressureof first space 31, and the negative pressure of second space 32 are setso that the suction force exerted on liquid LQ toward gap B becomeslarger than the suction force exerted on liquid LQ toward gap D, asdescribed above, liquid LQ having penetrated from gap A can be smoothlydrawn to the side of rear surface Tb of plate member T, and thus thedisadvantage that liquid LQ having penetrated from gap A would get intothe side of rear surface Pb of substrate P can be prevented. It shouldbe noted that by making rear surface Pb of substrate P and upper surface42A of first peripheral wall portion 42 in direct contact with eachother and thus by making gap D substantially zero, it can be morereliably prevented that liquid LQ having penetrated from gap Apenetrates into the side of first space 31 via between rear surface Pbof substrate P and upper surface 42A of first peripheral wall portion42.

It should be noted that, in the embodiment, liquid LQ held by absorbingmember 100 is recovered by recovery mechanism 101, but it may also beconfigured such that absorbing member 100 is provided detachably(exchangeably) relative to plate member T, and when absorbing member 100provided on rear surface Tb of plate member T has held a predeterminedamount of liquid LQ, the absorbing member is replaced by a new one.

Second Embodiment

Next, a second embodiment of the present invention will be describedreferring to FIG. 6. In the following description, the same orequivalent constituent elements as those in the above-describedembodiment are denoted by the same reference letters or numerals, andtheir descriptions will be abridged or omitted.

In FIG. 6, with respect to plate member T held by second holding portionPH2, on side surface Tc facing substrate P is provided recovery port 300that recovers liquid LQ. Inside plate member T is formed inner flow path301 which is connected to recovery port 300 and through which liquid LQflows. Recovery port 300 is connected to one end portion of inner flowpath 301; the other end portion of inner flow path 301 is connected toopening portion 302 provided in a predetermined position on rear surfaceTb of plate member T. Opening portion 302 is formed in a position wherewhen second holding portion PH2 holds plate member T, the openingportion 302 is disposed on second space 32. In other words, inner flowpath 301 of plate member T is provided so that inner flow path 301connects recovery port 300 with second space 32.

In fact, recovery ports 300 are formed plurally on side surface Tc ofplate member T at predetermined intervals in the circumferentialdirection; inner flow paths 301 are also provided plurally in accordancewith the number of recovery ports 300. Further, while, in FIG. 6, it isillustrated in such a manner that one opening portion 302 is providedfor one recovery port 300, it may also be configured such that aplurality of opening portions 302 are provided for one recovery port300, that inner flow path 301, starting from the recovery port, is madeto branch along its way toward the other end into a plurality of innerflow paths, and that each of the branch inner flow paths is connected toeach of the plurality of opening portions 302.

By making second space 32 have a negative pressure by activating secondvacuum system 60, controller CONT can make plate member T's inner flowpaths 301, which connect to second space 32, have a negative pressure.With inner flow paths 301 having a negative pressure, liquid LQ havingpenetrated from gap A between substrate P held by first holding portionPH1 and plate member T held by second holding portion PH2 is recoveredvia recovery ports 300. Liquid LQ having been recovered via recoveryports 300 flows through inner flow paths 301 and then flows into secondspace 32 via opening portions 302. Here, since, as with theabove-described first embodiment, second suction ports 61 providedinside second space 32 have a function of liquid recovery ports forrecovering liquid LQ, the liquid LQ having recovered via recovery ports300 of plate member T and having flowed through inner flow paths 301 issuck-and-recovered by second suction ports 61 (second vacuum system 60).

Since, as described above, even if liquid LQ has penetrated from gap A,the penetrated liquid LQ can be recovered via recovery ports 300, whichare located inside gap A and are provided on plate member T's sidesurface Tc, the disadvantage that liquid LQ having penetrated from gap Awould find its way over to the side of rear surface Pb of substrate Pcan be prevented.

Further, by making the recovery ports 300's vicinity areas on sidesurface Tc of plate member T and the inner walls of inner flow paths 301lyophilic, liquid LQ can be more smoothly recovered. For example, bysandwiching pipe members made of a lyophilic material between two (orany plurality of) plate members for forming plate member T, lyophilicinner flow paths 301 can be formed inside plate member T.

It is to be noted that while, in the embodiment of FIG. 6, by connectingrecovery ports 300 to second space 32 by inner flow paths 301 and bymaking second space 32 have a negative pressure by using second vacuumsystem 60, liquid LQ having penetrated from gap A is recovered viarecovery ports 300, it may also be configured such that, as shown inFIG. 7, the other end of inner flow path 301 is connected to openingportion 303 formed in a predetermined position on the plate member T'sside surface that does not face substrate P or in a predeterminedposition on plate member T's surface Ta, and, further, opening portion303 is connected to vacuum system 304. By making inner flow paths 301 byactivating vacuum system 304, controller CONT can recover liquid LQ viarecovery ports 300. Liquid LQ having been recovered via recovery ports300 flows through inner flow paths 301 and is then recovered by vacuumsystem 304 via opening portions 303.

Third Embodiment

Next, a third embodiment of the present invention will be describedreferring to FIG. 8. In FIG. 8, first peripheral wall portion 42's uppersurface 42A, which faces rear surface Pb of substrate P, is applied witha surface roughening treatment. Since first peripheral wall portion 42'supper surface 42A applied with a surface roughening treatment preventsthe movement of liquid LQ at gap D formed between substrate P's rearsurface Pb and upper surface 42A, even if liquid LQ has penetrated fromgap A, it can be prevented that the penetrated liquid LQ penetrates fromgap A into first space 31 on the side of substrate P's rear surface Pbvia gap D.

It is to be noted that as the surface roughening treatment, a method of,e.g., sandblasting may used, or it may also be configured such that, asshown in FIG. 9, groove portions 320 are formed on first peripheral wallportion 42's upper surface 42A along the circumferential direction. Inthe example shown in FIG. 9, groove portions 320 are formed plurally andconcentrically.

Fourth Embodiment

Next, a fourth embodiment of the present invention will be describedreferring to FIG. 10. In FIG. 10, sheet-shaped member 400 made of aliquid-repellent material is provided on a substrate P's rear surfacePb's portion located near gap A. As the liquid-repellent materialforming sheet-shaped member 400, there can be listed, e.g., afluoroplastic material and an acrylic plastic material. In thisembodiment, “Gore-Tex (brand name)” is used for sheet-shaped member 400.Sheet-shaped member 400 is formed to be ring-shaped in accordance withthe peripheral region of substrate P and is disposed on the substrateP's rear surface Pb's peripheral region. As described above, theperipheral region of substrate P overhangs outside first peripheral wallportion 42 by a predetermined amount, and sheet-shaped member 400 isdisposed so that it includes substrate P's rear surface Pb's overhangregion Pbh and a partial region of the rear surface Pb's region facingfirst peripheral wall portion 42's upper surface 42A. It is to be notedthat sheet-shaped member 400 may be disposed only on substrate P's rearsurface Pb's overhang region Pbh, which does not face first peripheralwall portion 42's upper surface 42A or may be disposed on a wide regionof the substrate P's rear surface Pb's peripheral region so thatsheet-shaped member 400 faces the entire region of upper surface 42A offirst peripheral wall portion 42.

By, in this manner, disposing the liquid-repellent sheet-shaped member400 on a substrate P's rear surface Pb's region that is located near gapA and includes the rear surface Pb's region outside gap D, even ifliquid LQ having penetrated from gap A becomes liable to penetrate intofirst space 31 on substrate P's rear surface Pb, penetration of theliquid LQ can be hindered by sheet-shaped member 400.

Fifth Embodiment

Next, a fifth embodiment of the present invention will be describedreferring to FIG. 11. In FIG. 11, on base member PHB and outside firstperipheral wall portion 42 is provided liquid-repellent member 450having a liquid-repellency relative to the liquid LQ. Liquid-repellentmember 450 is formed to be ring-shaped so as to surround the outside offirst peripheral wall portion 42. As the liquid-repellent materialforming liquid-repellent member 450, there can be listed, e.g., afluoroplastic material and an acrylic plastic material. As with theabove-described fourth embodiment, “Gore-Tex (brand name)” is used forliquid-repellent member 450. Liquid-repellent member 450 is providedbeneath overhang region Pbh of rear surface Pb of substrate P, and uppersurface 450A of liquid-repellent member 450 faces rear surface Pb ofsubstrate P held by first holding portion PH1.

By, in this manner, disposing liquid-repellent member 450 on a regionthat is located near gap A and outside gap D, even if liquid LQ havingpenetrated from gap A becomes liable to penetrate into first space 31 onsubstrate P's rear surface Pb, penetration of the liquid LQ can beprevented by liquid-repellent member 450.

Sixth Embodiment

Next, a sixth embodiment of the present invention will be describedreferring to FIG. 12. In FIG. 12, on base member PHB and outside firstperipheral wall portion 42 is provided porous member 500 that is capableof retaining liquid LQ. Porous member 500 is for retaining liquid LQhaving penetrated from gap A. Between first peripheral wall portion 42and second peripheral wall portion 62, porous member 500 is formed to bering-shaped so as to surround the outside of first peripheral wallportion 42. Porous member 500 is disposed under gap A. Further, porousmember 500 is formed widely so that it covers both of the region undersubstrate P's rear surface Pb's overhang region Pbh and the region underplate member T's rear surface Pb's overhang region Tbh. And, uppersurface 500A of porous member 500 faces rear surface Pb (overhang regionPbh) of substrate P held by first holding portion PH1 and rear surfaceTb (overhang region Tbh) of plate member T held by second holdingportion PH2.

Further, substrate holder PH is provided with recovery mechanism 501that suck-and-recovers liquid LQ held by porous member 500. Recoverymechanism 501 is provided with recovery port 503 formed in apredetermined position on base member PHB and between first peripheralwall portion 42 and second peripheral wall portion 62 and with vacuumsystem 505 that is connected to recovery port 503 via flow path 504.Recovery port 503 is provided in each of a plurality of predeterminedpositions on base member PHB and between first peripheral wall portion42 and second peripheral wall portion 62. Rear surface 500B of porousmember 500 is provided so as to be in contact with the base member PHB'sportion which is located between first peripheral wall portion 42 andsecond peripheral wall portion 62 and on which recovery ports 503 areformed. When vacuum system 505 is activated, liquid LQ held by porousmember 500 is suck-and-recovered toward vacuum system 505 via recoveryports 503, which are in contact with porous member 500, and is thenstored into a predetermined tank. Since recovery ports 503 are formed onthe base member PHB's upper surface portion, which is in contact withporous member 500, liquid LQ held by porous member 500 can be smoothlyrecovered. Further, midway along flow path 504 between recovery ports503 and vacuum system 505 is provided a gas-liquid separator thatseparates liquid LQ recovered through recovery ports 503 from gas, andthus liquid LQ is prevented from flowing into vacuum system 505.

Since by, in this manner, disposing porous member 500 on a region thatis located under gap A and outside gap D, liquid LQ having penetratedfrom gap A can be held by porous member 500, the disadvantage thatliquid LQ having penetrated from gap A would get to the side of rearsurface Pb of substrate P can be prevented.

It should be noted that, in this embodiment, liquid LQ held by porousmember 500 is recovered by recovery mechanism 501, but it may also beconfigured such that porous member 500 is provided detachably(exchangeably) relative to base member PHB, and when porous member 500has retained a predetermined amount of liquid LQ, the porous member isreplaced by a new one.

Seventh Embodiment

Next, a seventh embodiment of the present invention will be describedreferring to FIG. 13. In FIG. 13, a portion of upper surface 42A offirst peripheral wall portion 42 faces rear surface Pb of substrate P,but the remaining portion thereof is disposed under gap A. In otherwords, in this embodiment, substrate P is not provided with any overhangportion, and first peripheral wall portion 42's upper surface 42A isformed such that its width (first peripheral wall portion's size in theradial direction) 42H is relatively large (wide).

Since, in this manner, by forming first peripheral wall portion 42'supper surface 42A widely, without providing any overhang portion, thelargeness (length) 42H′ where first peripheral wall portion 42's uppersurface 42A faces substrate P's rear surface Pb is made large, liquid LQhaving penetrated from gap A becomes hard to penetrate into first space31 via gap D. Thus, the disadvantage that liquid LQ having penetratedfrom gap A would find its way over to the side of rear surface Pb ofsubstrate P can be prevented.

Eighth Embodiment

Next, an eighth embodiment of the present invention will be describedreferring to FIG. 14. In FIG. 14, at least a portion of the firstperipheral wall portion 42 is formed by a porous body 600. In thisembodiment, first peripheral wall portion 42 is constituted by the samematerial (e.g., a metal) as base member PHB and is provided with insidesurface 42B provided on the side of first space 31 and with outsidesurface 42C provided so as to face second peripheral wall portion 62.Between inside surface 42B and outside surface 42C is provided porousbody 600. Thus, in the embodiment, upper surface 42A is also formed byporous body 600. Since by forming at least a portion of the firstperipheral wall portion 42 by porous body 600, even if liquid LQ haspenetrated from gap A, the liquid LQ is retained by porous body 600,penetration of liquid LQ into the side of rear surface Pb of substrate Pcan be prevented.

Further, substrate holder PH is provided with recovery mechanism 601that suck-and-recovers, via porous body 600, liquid LQ on porous body600's surface, i.e., in the embodiment, upper surface 600A of porousbody 600 forming upper surface 42A of first peripheral wall portion 42.Recovery mechanism 601 is provided with recovery port 603 formed in thebase member PHB's portion with which rear surface 600B of porous body600 is in contact and with vacuum system 605 that is connected torecovery port 603 via flow path 604. When vacuum system 605 isactivated, liquid LQ on upper surface 600A of porous body 600 moves, inporous body 600, from upper surface 600A toward rear surface 600B and isthen suck-and-recovered by vacuum system 605 via recovery port 603,which is in contact with rear surface 600B of porous body 600.

Since, in this manner, even if liquid LQ having penetrated from gap Abecomes liable to pass through gap D, the liquid LQ is retained byporous body 600, and the liquid LQ on upper surface 600A of porous body600 is further suck-and-recovered by vacuum system 605 via recovery port603, penetration of liquid LQ into first space 31 can be prevented.

Ninth Embodiment

Next, a ninth embodiment of the present invention will be describedreferring to FIG. 15. In FIG. 15, first peripheral wall portion 42 isformed by porous body 700.

Further, substrate holder PH is provided with gas supply mechanism 701that blows out a gas from the surface of porous body 700 via porous body700. Gas supply mechanism 701 is provided with blowout port 703 formedin the base member PHB's portion with which rear surface 700B of porousbody 700 is in contact and with gas supply system 705 that is connectedto blowout port 703 via flow path 704. When gas supply system 705 isactivated, the gas delivered from gas supply system 705 flows throughflow path 704 and is then blown against rear surface 700B of porous body700 via blowout port 703. The gas blown against rear surface 700B passesthrough the inside of porous body 700 and then blows out to the outsidefrom porous body 700's upper surface 700A of (i.e., upper surface 42A offirst peripheral wall portion 42), porous body 700's inside face 700C(i.e., inside face 42B of first peripheral wall portion 42), and porousbody 700's outside face 700D (i.e., outside face 42C of first peripheralwall portion 42). Thus, even if liquid LQ having penetrated from gap Abecomes liable to penetrate into first space 31 via gap D, penetrationof liquid LQ into first space 31 can be blocked by the flow of the gasblowing out from upper surface 700A, outside face 700D, etc. of porousbody 700.

It should be noted that it may also be configured such that to porousbody 600 constituting first peripheral wall portion 42, as shown in FIG.14, is connected gas supply mechanism 701, and a gas is blown out fromupper surface 600A of porous body 600 or such that to porous body 700constituting first peripheral wall portion 42, as shown in FIG. 15, isconnected recovery mechanism 601, and liquid LQ on the surface of porousbody 700, including each of upper surface 700A, inside face 700C, andoutside face 700D, is recovered.

Tenth Embodiment

Next, a tenth embodiment of the present invention will be describedreferring to FIG. 16. In FIG. 16, in the surface of first peripheralwall portion 42 is provided blowout port 803 that blows out a gas. Inthe example shown in FIG. 16, blowout port 803 is provided in each ofupper surface 42A, inside face 42B, and outside face 42C of firstperipheral wall portion 42. To blowout ports 803 is connected gas supplysystem 805 via flow path 804. When gas supply system 805 is activated,the gas delivered from gas supply system 805 flows through flow path 804and then blows out to the outside of first peripheral wall portion 42via blowout ports 803. Thus, even if liquid LQ having penetrated fromgap A becomes liable to penetrate into first space 31 via gap D,penetration of liquid LQ into first space 31 can be blocked by the flowof the gas blowing out from blowout ports 803.

Eleventh Embodiment

In the above-described first to tenth embodiments, there has beendescribed the case where liquid LQ having penetrated from gap A betweenplate member T and substrate P is handled, but there is, as shown inFIG. 17, the case where on substrate holder PH is provided, for example,light measurement portion 900 that measures the illumination conditionof exposure light EL via projection optical system PL and liquid LQ.Light measurement portion 900 of FIG. 17 schematically shows such anillumination uniformity sensor as disclosed in, e.g., JapaneseUnexamined Patent Application, Publication No. S57-117238 and isprovided with upper plate 901 having a light transmissivity and opticalelement 902 provided beneath upper plate 901. On upper plate 901 isprovided thin film 960 including a light-shielding material, e.g.,chromium, and in a portion of thin film 960 is provided pinhole portion970 through which the light can transmit. Upper plate 901 and opticalelement 902 are supported by supporting member 903 provided on basemember PHB. Supporting member 903 has a continuous wall portion thatsurrounds upper plate 901 and optical element 902. Further, underoptical element 902 is disposed light sensor 950 that receives the light(exposure light EL) having passed through pinhole portion 970. Lightsensor 950 is disposed on base member PHB.

In a predetermined position of plate member T is formed hole portion TH′for disposing light measurement portion 900. Between upper plate 901(supporting member 903) and plate member T is formed a predetermined gapA′. Further, upper surface 901A of upper plate 901 of light measurementportion 900 and surface Ta of plate member T held by second holdingportion PH2 constitute substantially the same plane.

Further, on plate member T's side surface Tc that faces upper plate 901is formed such a recovery port 300 as described in the above-describedsecond embodiment. There is a possibility that when a light measurementusing light measurement portion 900 is performed in the state in whichprojection area AR2 of liquid LQ is formed on upper plate 901, liquid LQpenetrates from gap A′, but the liquid LQ having penetrated from gap A′can be recovered via recovery port 300. Of course, it may also beconfigured such that such an absorbing member 100 as in theabove-described first embodiment is disposed on a region, located in thevicinity of gap A′, of rear surface Tb of plate member T or such thatsuch a liquid-repellent member (450) or a porous member (500) asdescribed referring to FIG. 11 or FIG. 12 is provided so as to surroundsupporting member 903.

As described above, in the embodiments, liquid LQ is purified water.Purified water has the advantage that it is easily available in bulk in,e.g., semiconductor manufacturing factories and also the advantage thatit does not adversely affect photoresist on substrate P, opticalelements (lenses), etc. Further, purified water does not adverselyaffect the environment and contains scarcely any impurities; thus, theeffect that it cleans the surface of substrate P and the surface of theoptical element provided at the end portion of projection optical systemPL can be expected. It should be noted that when the purity of thepurified water supplied from, e.g., the factory, it may be configuredsuch that the exposure apparatus itself has an ultrapure water system.

The refractive index n of purified water (water) relative to exposurelight EL having a wavelength of about 193 nm is said to be approximately1.44, and when ArF excimer laser light (having 193 nm wavelength) isused as the light source of exposure light EL, the wavelength iseffectively shortened, on substrate P, as if multiplied by 1/n, i.e.,effectively becomes approximately 134 nm, and thus, a high resolutioncan be obtained. Further, since the depth of focus increases byapproximately n times, i.e., approximately by 1.44 times, compared withthat in the air, when securing of the depth of focus on par with thedepth of focus realized when the projection optical system is used inthe air suffices, the numerical aperture of the projection opticalsystem PL can be further increased; which also improves the resolution.

It is to be noted that when the liquid immersion method is used asdescribed above, the numerical aperture NA of the projection opticalsystem may become 0.9 to 1.3. When, in this manner, the numericalaperture NA of the projection optical system becomes large, arandom-polarized light conventionally used as the exposure light may,because of its polarization effect, adversely affect the imagingperformance; thus, a polarized light illumination method is preferablyused. In that case, it is preferable that by performing linearlypolarized light illumination in which the longitudinal direction of theline pattern of the line-and-space patterns on the mask (reticle) isaligned with the polarization direction, a lot of diffraction lightsfrom S polarization components (TE polarization components), i.e., thediffraction lights from the polarization components having thepolarization direction in line with the longitudinal direction of theline pattern are emitted from the pattern of the mask (reticle). Whenthe space between projection optical system PL and the resist applied tothe surface of substrate P is filled with the liquid, the transmittanceat the resist surface of the diffraction lights from S polarizationcomponents (TE polarization components), which contribute to theimprovement of the contrast, is higher compared with the case where thespace between projection optical system PL and the resist applied to thesurface of substrate P is filled with the gas (air), a high imagingperformance can be obtained even in the case where the numericalaperture NA of the projection optical system is over 1.0. Further, aphase shift mask, an oblique incidence illumination method (inparticular, a dipole illumination method), as disclosed in JapaneseUnexamined Patent Application, Publication No. H06-188169, which meetsthe longitudinal direction of the line pattern, etc. may beappropriately combined with the above configuration, which works moreeffectively. In particular, a combination of a linearly polarized lightillumination method and a dipole illumination method works effectivelywhen the periodic direction of line-and-space patterns is limited to apredetermined single direction or when hole patterns are densely locatedalong a predetermined direction. For example, assuming that, when ahalf-tone type phase shift mask having a transmittance of 6% (patternhaving a half-pitch of about 45 nm) is illuminated by using acombination of a linearly polarized light illumination method and adipole illumination method, illumination σ defined by the circumscribingcircle of the two light beams forming the dipole in the pupil plane is0.95, that the radius of each of the light beams in the pupil plane is0.125σ, and that the numerical aperture NA of projection optical systemPL is 1.2, the depth of focus (DOF) can be increased by about 150 nmcompared with that when a random-polarized light is used.

Further, a combination of a linearly polarized light illumination methodand a small σ illumination method (in which the σ value defined by theratio of the illumination system's numerical aperture NAi and theprojection optical system's numerical aperture Nap becomes less than0.4) also effectively works.

It should be noted that, for example, when by using, for example, ArFexcimer laser light as the exposure light and using projection opticalsystem PL having a reduction magnification of about ¼, a fineline-and-space pattern (e.g., line-and-space of about 25 to 50 nm) isexposed onto substrate P, depending on the structure of mask M (e.g.,the fineness of the pattern or the thickness of chrome), mask M acts asa polarization plate due to the Wave Guide effect, and the emittedamount of the diffraction lights from S polarization components (TEpolarization components) becomes larger than the emitted amount of thediffraction lights from P polarization components (TM polarizationcomponents), which lower the contrast. In this case, the above-describedlinearly polarized light illumination is preferably employed, but evenwhen mask M is illuminated with a random-polarized light, a highresolution performance can be obtained even in the case where thenumerical aperture NA of the projection optical system PL is 0.9 to 1.3.

Further, although, for example, when a very fine line-and-space patternon mask M is exposed onto substrate P, there is the possibility that theemitted amount of the diffraction lights from P polarization components(TM polarization components) becomes larger than the emitted amount ofthe diffraction lights from S polarization components (TE polarizationcomponents) due to the Wire Grid effect, since, for example, when byusing, for example, an ArF excimer laser light as the exposure light andusing projection optical system PL having a reduction magnification ofabout ¼, a line-and-space pattern of more than 25 nm is exposed ontosubstrate P, the emitted amount of the diffraction lights from Spolarization components (TE polarization components) is larger than theemitted amount of the diffraction lights from P polarization components(TM polarization components), a high resolution performance can beobtained even in the case where the numerical aperture NA of theprojection optical system is 0.9 to 1.3.

Further, not only the linearly polarized light illumination, in whichthe longitudinal direction of the line pattern on the mask (reticle) isaligned with the polarization direction, but also the combination, asdisclosed in Japanese Unexamined Patent Application, Publication No.H06-53120, of a polarized light illumination method in which the lightsused are linearly polarized in the tangential directions relative to acircle of which center is the optical axis and an oblique incidenceillumination method is effective. In particular, in a case where thepattern of the mask (reticle) includes not only line patterns whichextend in a predetermined single direction but also line patterns whichextends in multiple different directions (a case where line-and-spacepatterns having different periodic directions exist mixedly), by using,as also disclosed in Japanese Unexamined Patent Application, PublicationNo. H06-53120, a polarized light illumination method in which the lightsused are linearly polarized in the tangential directions relative to acircle of which center is the optical axis in combination with anannular illumination method, a high resolution performance can beobtained even in the case where the numerical aperture NA of theprojection optical system is large. For example, assuming that, when ahalf-tone type phase shift mask having a transmittance of 6% (patternhaving a half-pitch of about 63 nm) is illuminated by using acombination of a polarized light illumination method in which the lightsused are linearly polarized in the tangential directions relative to acircle of which center is the optical axis and an annular illuminationmethod (having an annular ratio of 3 to 4), the illumination σ is 0.95and that the numerical aperture NA of projection optical system PL is1.00, the depth of focus (DOF) can be increased by about 250 nm comparedwith that when a random-polarized light is used, and, when assuming thata pattern having a half-pitch of about 55 nm is illuminated and thenumerical aperture NA of projection optical system PL is 1.2, the depthof focus can be increased by about 100 nm.

Further, in addition to the above-described various kinds ofillumination methods, it is also effective to apply a progressive focusexposure method, as disclosed in, e.g., Japanese Unexamined PatentApplication, Publication No. H04-277612 or Japanese Unexamined PatentApplication, Publication No. 2001-345245, or a multi-wavelength exposuremethod in which by using an exposure light of multiple wavelengths(e.g., two wavelengths), an effect equivalent to that of the progressivefocus exposure method is obtained.

In the embodiments, optical element 2 is attached to the end ofprojection optical system PL, and by this lens, the opticalcharacteristics of projection optical system PL (spherical aberration,coma aberration, etc.) can be adjusted. It should be noted that as theoptical element to be attached to the end of projection optical systemPL, an optical plate used for the adjustment of the opticalcharacteristics of projection optical system PL may be utilized.Alternatively, a plane parallel plate that can transmit exposure lightEL may be utilized.

It should be noted that if the pressure, caused by the flow of liquidLQ, of the space between the optical element located at the end ofprojection optical system PL and substrate P is high, it may beconfigured such that the optical element is rigidly fixed so as not tomove due to the pressure, instead of making the optical elementreplaceable.

It should be noted that while, in the embodiments, it is configured suchthat the space between projection optical system PL and the surface ofsubstrate P is filled with liquid LQ, it may also be configured, forexample, such that the space is filled with liquid LQ in the conditionthat a cover glass constituted by a plane parallel plate is attached tothe surface of substrate P.

It should be noted that while, in the embodiments, liquid LQ is water(purified water), liquid LQ may be a liquid other than water. Forexample, when the light source of exposure light EL is an F₂ laser, theF₂ laser light does not transmit through water, and thus, as liquid LQ,a fluorofluid that can transmit the F₂ laser light, such asperfluoropolyether (PFPE) or fluorochemical oil, may be used. In thiscase, the portions that come into contact with liquid LQ are appliedwith lyophilic treatment, by forming a thin film of a substance whichincludes, e.g., fluorine and has a molecular structure of a smallpolarity. Further, as liquid LQ, a material (e.g., cedar oil) that cantransmit exposure light EL, has a high refractive index as high aspracticable, and does not affect projection optical system PL and thephotoresist applied to the surface of substrate P can also be used. Alsoin this case, the surface treatment is applied in accordance with thepolarity of liquid LQ to be used.

It is to noted that regarding substrate P of each of the above-describedembodiments, not only a semiconductor wafer for manufacturing asemiconductor device, but also a glass substrate for a display device, aceramic wafer for a thin film magnetic head, a master mask or reticle(synthetic quartz or silicon wafer), etc. can be used.

Regarding exposure apparatus EX, in addition to a scan type exposureapparatus (scanning stepper) in which while synchronously moving mask Mand substrate P, the pattern of mask M is scan-exposed, astep-and-repeat type projection exposure apparatus (stepper) in whichthe pattern of mask M is exposed at one time in the condition that maskM and substrate P are stationary, and substrate P is successively movedstepwise can be used.

Further, regarding exposure apparatus EX, the present invention can beapplied to an exposure apparatus in which in the state that a firstpattern and substrate P are substantially stationary, the reductionimage of the first pattern is exposed at one time by using a projectionoptical system (e.g., a refraction type projection optical system thathas a reduction magnification of ⅛ and includes no reflecting element).In this case, the present invention can be applied to a stitch typeone-shot exposure apparatus in which thereafter, in the state that asecond pattern and substrate P are substantially stationary, thereduction image of the second pattern is exposed at one time ontosubstrate P by using the projection optical system in a manner that thefirst pattern image and the second pattern image partially overlap witheach other. Further, in conjunction with the stitch type exposureapparatus, the present invention can also be applied to astep-and-stitch type exposure apparatus in which at least two patternsare transferred onto substrate P in a partially overlapping manner, andsubstrate P is successively moved.

Further, the present invention can also be applied to a twin-stage typeexposure apparatus which is disclosed in, e.g., Japanese UnexaminedPatent Application, Publication No. H10-163099, Japanese UnexaminedPatent Application, Publication No. H10-214783, and Published JapaneseTranslation No. 2000-505958 of the PCT International Publication.

Further, the present invention can also be applied to an exposureapparatus provided with a substrate stage and a measurement stage, asdisclosed in Japanese Unexamined Patent Application, Publication No.H11-135400.

Regarding the type of exposure apparatus EX, the present invention isnot limited to an exposure apparatus, which exposes a semiconductorpattern onto substrate P, for manufacturing semiconductor devices, butcan also be applied to a variety of exposure apparatuses, e.g., anexposure apparatus for manufacturing liquid crystal display devices or adisplays, an exposure apparatus for manufacturing thin film magneticheads, an exposure apparatus for manufacturing image pickup devices(CCDs), and an exposure apparatus for manufacturing reticles or masks.

When using a linear motor (see U.S. Pat. No. 5,623,853 or U.S. Pat. No.5,528,118) in substrate stage PST or mask stage MST, either air-cushiontype linear motor using an air bearing or a magnetic levitation typelinear motor using a Lorentz force or reactance force may be used.Further, substrate stage PST may be either of a type moving along aguide or of a guideless type having no guide. Further, each of stagesPST and MST may be either of a type moving along a guide or of aguideless type having no guide.

As the driving mechanism for each of stages PST and MST, a planar motorin which by making a magnet unit in which magnets are two-dimensionallyarranged and an armature unit in which coils are two-dimensionallyarranged face each other, each of PST and MST is driven by anelectromagnetic force may be used. In this case, either one of themagnet unit and the armature unit is attached to stage PST or stage MST,and the other unit is attached to the moving surface side of stage PSTor stage MST.

A reaction force generated by the movement of substrate stage PST maybe, as described in Japanese Unexamined Patent Application, PublicationNo. H08-166475 (U.S. Pat. No. 5,528,118), mechanically released to thefloor (earth) by use of a frame member so that the force does nottransmit to projection optical system PL.

A reaction force generated by the movement of mask stage MST may be, asdescribed in Japanese Unexamined Patent Application, Publication No.H08-330224 (corresponding to U.S. Pat. No. 5,874,820), mechanicallyreleased to the floor (earth) by use of a frame member so that the forcedoes not transmit to projection optical system PL.

Exposure apparatus EX according to the embodiments of the presentapplication is built by assembling various subsystems, including eachelement listed in the claims of the present application, in such amanner that prescribed mechanical accuracy, electrical accuracy, andoptical accuracy are maintained. In order to ensure the variousaccuracies, prior to and after the assembly, every optical system isadjusted to achieve its optical accuracy, every mechanical system isadjusted to achieve its mechanical accuracy, and every electrical systemis adjusted to achieve its electrical accuracy. The process ofassembling each subsystem into the exposure apparatus includesmechanical interfaces, electrical circuit wiring connections, and airpressure plumbing connections between each subsystem. Needless to say,there is also a process where each subsystem is assembled prior to theassembling of the exposure apparatus from the various subsystems. Oncompletion of the process of assembling the various subsystems in theexposure apparatus, overall adjustment is performed to make sure thatevery accuracy is maintained in the complete exposure apparatus.Additionally, it is desirable to manufacture the exposure apparatus in aclean room, in which the temperature, purity, etc. are controlled.

As shown in FIG. 18, micro devices such as semiconductor devices aremanufactured by a series of steps, including: step 201 in which themicro device's function and performance design is performed; step 202 inwhich a mask (reticle) is manufactured based on the design step; step203 in which a substrate, the device's base material, is manufactured;substrate processing step 204 including a process in which the maskpattern is exposed onto the substrate by exposure apparatus EX accordingto the above-described embodiments; device assembly step 205 (includinga dicing process, a bonding process, and a packaging process);inspection step 206.

What is claimed is:
 1. An exposure apparatus that exposes a substratevia a projection optical system and via a liquid immersion region, whichis formed with a liquid supplied below the projection optical system,the exposure apparatus comprising: a stage device that is capable ofmoving relative to the liquid immersion region, wherein the stage devicecomprises: a holding portion that holds the substrate; a flat portionthat is provided so that the substrate held by the holding portion issurrounded by the flat portion; a porous member; and a recovery portionthat recovers the liquid via the porous member, the liquid penetratedinto a gap, the gap being formed between the flat portion and thesubstrate held by the holding portion and being moved below the liquidimmersion region.